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DCB Ceramic Substrate
Direct Copper Bonding Substrate（DCB）
What is direct copper bonding substrate ?
Direct copper bonding substrate is a kind of composite substrate, manufactured by thermal melting and bonding method, that is , bond the copper sheet directly onto the ceramic surface of Al2O3 and AlN. Such substrate can be applied in various kinds of packaging of electronic module with possibility to etch various kinds of pattern on copper surface. It is a green product without pollution and public harm, which also has a wide range of operating temperature.
DCB performance advantages
Good mechanical strength
Good thermal conductivity
Coefficient of thermal expansion close to silicon
DCB performance advantages
Good thermal stability
Good insulation/dielectric strength
Possibility to etch various kinds of pattern like PCB substrate
Data Download
DBC覆銅陶瓷基板樣冊(cè)
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Tel: 021-36160564
Tel: 021-36160564
Automotive electronic power steering
Automotive electronic power steering
LED lighting
LED lighting
Laser
Laser
Home appliance-air conditioning
Home appliance-air conditioning
Solar convertor
Solar convertor
Power supplies
Power supplies
DCB application
Ferrotec (China) has over 20 years’ production experience on DCB substrate, of which quality is close to international advanced level, and can provide different parameter products as per customer request as well.DCB substrate is widely used in many fields, including semi-conductor cooler, electronic heater, high-power power semi-conductor module, power control circuit, power hybrid circuit, intelligent power element, high frequency switching power supply, solid-state relay, automotive electronics, aerospace and military electronic element, solar panel element, telecommunication private exchange, receiving system, laser and many other industry electronic fields.
Matrix diagram of applications in various fields
Semiconductor correlation
DCB Ceramic Substrate

Thermoelectric refrigerator;

Wind power stations;

Solar energy converter;

LED lighting；

IGBT module;

IPM module;

MOS modules;

Power supply;

ABS;

Electronic transmission;

LED lamp;

Hybrid cars;

Electric cars;

High-speed railway/bullet train;

White household appliance;

Thermoelectric module;
Production base
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